BSB165N15NZ3G: A 150V N-Channel Power MOSFET for High-Efficiency Switching Applications

Release date:2025-10-29 Number of clicks:72

BSB165N15NZ3G: A 150V N-Channel Power MOSFET for High-Efficiency Switching Applications

The relentless pursuit of higher efficiency and power density in modern electronic systems places immense demands on power switching components. At the heart of many advanced power conversion units, from industrial motor drives and telecom power supplies to high-performance computing, lies the power MOSFET. The BSB165N15NZ3G, a 150V N-Channel MOSFET, emerges as a critical component engineered to meet these challenges, offering a compelling blend of low losses, robust performance, and high reliability.

A primary factor defining the performance of any switching device is its on-state resistance, denoted as RDS(on). The BSB165N15NZ3G boasts an exceptionally low maximum RDS(on) of just 16.5 mΩ. This ultra-low resistance is paramount for minimizing conduction losses—the power dissipated as heat when the device is fully turned on. In high-current applications, even a small reduction in RDS(on) translates to significant gains in overall system efficiency, reduced thermal stress, and the potential for a smaller form factor as less heat sinking is required.

However, efficiency is not solely about conduction. Switching losses, which occur during the rapid transitions between on and off states, become increasingly critical at higher operating frequencies. The BSB165N15NZ3G is designed with superior switching characteristics, featuring low gate charge (Qg) and low output capacitance (Coss). These parameters ensure fast switching speeds, which reduce the time spent in the high-loss transition region. This allows designers to push switching frequencies higher, enabling the use of smaller passive components like inductors and capacitors, thereby increasing power density without sacrificing efficiency.

Beyond its electrical performance, the device is housed in a TOLL (TO-Leadless) package. This advanced surface-mount package offers a significantly reduced footprint and profile compared to traditional packages like the D2PAK. More importantly, its leadless design minimizes parasitic inductance, which is a major contributor to voltage overshoot and ringing during switching. The TOLL package also features an exposed metal top that allows for direct cooling, significantly enhancing thermal performance and enabling the MOSFET to handle high power levels effectively.

Furthermore, the 150V voltage rating provides a comfortable margin of safety for applications operating with 48V to 100V bus rails, such as 48V server power systems, industrial automation, and telecom infrastructure. This robust voltage capability ensures resilience against voltage spikes and transients common in harsh electrical environments, enhancing system reliability and longevity.

ICGOODFIND: The BSB165N15NZ3G stands out as a high-performance solution where efficiency, thermal management, and power density are paramount. Its combination of ultra-low RDS(on), excellent switching performance, and advanced TOLL packaging makes it an ideal choice for designers aiming to create the next generation of compact, efficient, and reliable power electronics.

Keywords: Low RDS(on), High-Efficiency Switching, TOLL Package, 150V Rating, Power Density

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