Infineon SP400-11-07: Advanced HybridPACK™ Drive Power Module for Automotive Traction Inverters

The rapid evolution of the automotive industry towards electrification demands power electronics that are not only highly efficient and powerful but also exceptionally reliable and compact. Addressing these core requirements, Infineon Technologies has introduced the SP400-11-07, a standout member of the proven HybridPACK™ Drive family. This power module is engineered specifically for automotive traction inverters, which are the heart of an electric vehicle's (EV) drivetrain, converting DC power from the battery into AC power to drive the electric motor.

At the core of the SP400-11-07 module is Infineon's advanced EDT2 IGBT (Insulated Gate Bipolar Transistor) and diode technology. This semiconductor technology is optimized for the demanding operating conditions of automotive applications, offering an excellent balance between low switching losses and low saturation voltage. This translates directly into higher inverter efficiency, which is paramount for extending the driving range of electric vehicles. The module is rated for 400 Amperes and designed for a DC link voltage of up to 750 V, making it suitable for a broad spectrum of battery-electric vehicles (BEVs) and plug-in hybrid electric vehicles (PHEVs).

Beyond its electrical performance, the mechanical design of the HybridPACK™ Drive is a key enabler for next-generation EVs. The SP400-11-07 features a compact and lightweight package with a low-induance design that minimizes voltage overshoot during switching, allowing for higher operating frequencies and further efficiency gains. Its baseplate is optimized for easy integration with liquid cooling systems, ensuring effective thermal management and superior power cycling capability—a critical factor for handling the relentless start-stop cycles and load variations in real-world driving. This robustness ensures long-term reliability under the hood, where temperatures can fluctuate dramatically.

Furthermore, the module simplifies the design-in process for automotive engineers. Its pre-assembled, transfer-molded package enhances creepage and clearance distances, improving system safety and reliability while reducing the manufacturing complexity for tier-one suppliers and OEMs. By offering a high level of integration, Infineon allows manufacturers to accelerate their time-to-market for new, more powerful, and efficient electric vehicle models.

ICGOODFIND: The Infineon SP400-11-07 HybridPACK™ Drive module represents a significant leap in power electronics for EVs, masterfully combining high power density, exceptional efficiency, and automotive-grade reliability. Its advanced EDT2 chip technology and optimized package design directly address the critical challenges of range, performance, and cost, solidifying its position as a cornerstone technology for the future of electric mobility.

Keywords: Automotive Traction Inverter, HybridPACK™ Drive, EDT2 IGBT Technology, Power Cycling Capability, Thermal Management.